• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    An electronic device comprising at least one electronic component mounted on a support and surrounded by a deformable envelope containing a thermally conductive and electrically insulating liquid, the device comprising a heat dissipation plate which is substantially parallel to the support and spaced from it, and thermal exchange means by conduction between the casing and the plate, the thermally conductive liquid and electrically insulating being chosen and the casing being arranged so that a thermal expansion of the oil causes a force application of the envelope against conductive heat exchange means.
    公开号:FR3016266A1
    申请号:FR1450097
    申请日:2014-01-07
    公开日:2015-07-10
    发明作者:Jean-Christophe Riou
    申请人:Sagem Defense Securite SA；
    IPC主号:
    专利说明:

    [0001] The present invention relates to an electronic device and more particularly to an electronic device subjected to power currents. Such a device generally comprises electronic power components which are fixed on a ceramic support and connected by cables to conductors allowing the electrical connection of the electronic device to the elements to which it is intended to be connected.
    [0002] It is known to use this type of device for example for feeding the phases of an electronic engine. In this application, the components are switches connected by diodes to the motor phases.
    [0003] The ceramic substrate is attached to a heat dissipation plate, or laying plane, to cool the components. However, the calories emitted by the components are transmitted to the heat dissipation plate by the ceramic substrate only in the area thereof extending vertically above each component. The heat transfer is in this way relatively limited so that the temperature of the device in operation is quite high and requires to separate the components from each other to promote their cooling. This results in a relatively large size of the device. This also results in a limitation of the power transmissible by the components so as to limit their heating. An object of the invention is to provide a means for better cooling such electronic devices so as to allow an increase in the power density of such modules.
    [0004] For this purpose, according to the invention, there is provided an electronic device comprising at least one electronic component mounted on a support and surrounded by a deformable envelope containing a thermally conductive and electrically insulating liquid. The device comprises a heat dissipation plate which is substantially parallel to the support and spaced therefrom, and thermal exchange means by conduction between the casing and the plate. The thermally conductive and electrically insulating liquid is chosen and the envelope is arranged so that a thermal expansion of the oil causes a force application of the envelope against the heat exchange means by conduction. The discharge towards the heat dissipation plate of the calories produced during the operation of the component is ensured mainly by the thermally conductive and electrically insulating liquid (like a silicone oil), the envelope and the heat exchange means by conduction. As the liquid is in direct contact with the component, the transfer of the calories to the liquid and then the envelope and the heat exchange means by conduction is favored, the thermally conductive liquid having a greater exchange surface between the component and the cold zone.
    [0005] As a result, the cooling of the component is relatively efficient. In addition, the heating of the liquid will cause an expansion thereof so that the liquid will exert a pressure on the envelope, which pressure will enhance the contact of the envelope with the heat exchange means by conduction, thus further improving the efficiency of heat transfer. Preferably, the heat exchange means comprise thermally conductive pads which extend over the heat dissipation plate and which have free ends spaced from each other to make contact with the envelope. The deformability of the envelope allows it to marry at least partly the shape of the free ends of the pads, increasing the heat exchange surface therewith. Advantageously, the pads are arranged to be crushed by the casing due to a thermal expansion of the thermally conductive and electrically insulating liquid.
    [0006] This crushing will increase the exchange surface between the free end of the pads and the envelope. These pads can be made of non-deformable or deformable materials in silver, indium or even in shape memory materials (iron and titanium alloy for example). A shape memory alloy is an alloy with several specific properties: - the ability to return to an initial shape after a deformation following the application of a simple heating, - the possibility of alternating between two forms previously "memorized" when its temperature varies around a critical temperature. The material will take one of the forms below the critical temperature and another form above, - a super-elastic behavior allowing elongations without plasticization higher (10%) than those of the other metals (a few percent), - 'rubbery' effect (the self-accommodated martensitic alloy undergoing deformation retains a residual deformation when released, if the material is again stressed and then unloaded, this residual deformation increases), - the damping effect because the alloy is capable of damping shocks or of attenuating mechanical vibrations (the superelasticity or even simply the elasticity of the martensitic phase exhibit a hysteresis phenomenon which results in dissipation of the energy). The shape memory material used can thus be deformed during integration of the module and will be chosen to have a critical temperature for return to initial position that is consistent with the operating temperatures of the module. Thus, the material always remains in the same position, in constant and elastic support between the envelope and the laying plane during operation. During a cold start, the shape memory material will deform to the other position thereby disconnecting the envelope and thermally insulating the module of the laying plane.
    [0007] Thus, this procedure will greatly accelerate the cold start time of the power module, the latter being heated as well as the atmosphere and allowing a contact of the pads in shape memory material.
    [0008] According to a particular embodiment, the support comprises a busbar-type electrical conductor, the device comprising means for compensating for differential expansions between the conductor and the component and, preferably, the compensation means comprises a section of the conductor which extends to the vicinity of the component and is thinned in thickness. The support then also provides an electrical connection function while absorbing the differential expansions. This furthermore makes it possible to simplify the structure of the device since the connections and the components are on the same substrate (namely the busbar). The connection clips may be of copper, potentially softened, or of shape memory material. In the latter case, the material will be chosen to use either the superelasticity characteristic or the "rubbery" effect characteristic, these characteristics allowing it to in fact accommodate very large thermal expansions compared to conventional materials (non-softened copper, iron, nickel ...) with improved aging in passive thermal cycling or power cycling. Other characteristics and advantages of the invention will emerge on reading the following description of particular non-limiting embodiments of the invention. Reference is made to the accompanying drawings, in which: FIG. 1 is a diagrammatic cross-sectional view of a device according to the invention; FIG. 2 is a diagrammatic view in cross-section along line II-II; 1 of one of the components of this device according to an advantageous variant embodiment of the invention; FIG. 3 is a detail view in section along the plane III of FIG. 1 of a compensation means; differential dilations. The electronic device is here described in application to the power supply of an electric motor. With reference to FIG. 1, the electronic device comprises a support, generally designated 1, for electronic power components, namely switches 10, and a control card 20. The support 1 comprises a rigid electrical conductor 30 busbar 2 passing through a frame 3 having an edge secured to a heat dissipation plate 4 or laying plane and an opposite edge on which the control board 20 is fixed. The control board 20 is of component type 35 mounted in surface (CMS or "Chip on board") and is connected to the busbar 2 by flexible conductors 21. The busbar 2 has a side projecting end 5 of the frame 3 forming power input / output means. The busbar 2 here comprises at least two layers of conductive tracks separated by an insulating layer. The switches 10 are here junction switches type IGBT transistor, MOSFET, SIC MOSFET, JFET, GaN. The switches 10 are four in number and are mounted in pairs on one another respectively on one of the two faces of the busbar 2. Each switch 10 is electrically connected to the busbar 2 or by welding portions of the switch 10 directly on the busbar 2 or by wires 6 at the ends welded respectively to the busbar 2 and to the switch 10.
    [0009] The switches 10 are connected to each other in parallel or low side / high side to form branches of a motor control bridge. The switches 10 of each pair are controlled to be alternating conductors. In a manner known per se, it is necessary to connect each switch a freewheeling diode to evacuate the return current from the load when the switch 10 is open. The busbar 2 comprises sections 7 which extend in the vicinity of the pairs of switches 10 and are thinned in thickness. The sections 7 form zones of relative flexibility forming means for compensating the differential expansions between the busbar 2 and the switches 10 so as to reduce the stress in the assemblies.
    [0010] Each pair of switches 10 is surrounded by a deformable envelope 30 containing a thermally conductive and electrically insulating liquid 31. The deformable envelope is made of a metal and especially a nickel alloy such as those produced under the trademark "Inconel" by the company Special Metals Corporation, and here has a thickness between 10 pm thermally conductive and insulating liquid 31 is a silicone oil. The device comprises thermal conduction between heat dissipation plate and 100 μm. Electrically exchange means the envelope 30 and 4. The envelope 30 is arranged so that, below a predetermined temperature, the envelope 30 is peeled from the heat exchange means by conduction. The conductive heat exchange means comprise thermally conductive pads 32 which extend over the heat dissipation plate 4 and which have free ends spaced apart from each other to contact the envelope 30. More precisely here , the pads 32 flare in the direction of the heat dissipation plate 4: they have a frustoconical shape here but could have a truncated pyramid shape. The studs 32 are made of silver and are arranged to be crushed by the casing 30 due to a thermal expansion of the thermally conductive and electrically insulating liquid 31. It will be understood that as the temperature of the switches increases, the liquid 31 heated, expands and deforms the membrane 30 forcing the latter in support of the pads 32 to ensure conductive heat transfer to the heat dissipation plate 4. If the temperature increases further, the force exerted by the envelope 30 on the pads 32 due to the expansion 30 of the liquid 31 is sufficient to deform the pads 32. This results in better conduction due to the contact force and the increase of the contact surface. It should be noted that the arrangement of the heat exchange means 35 makes it possible to mount power components on both sides of the busbar 2. It is therefore possible to mount twice as many power components in the module of the invention. By maintaining a relatively low average operating temperature, the heat exchange means also make it possible to mount the switches 10 in pairs on one another (stacking). This mounting principle associated with the alternating control of the switches not only saves space, as we have seen, but also reduce the thermal amplitudes experienced by each switch during active power cycles: indeed, each of the switches in its on state, and therefore heat emitter, maintains the average temperature of the switch pair while the other switch is in its off state. The limitation of the thermal cycles is favorable to the lifetime of the switches. Of course, the invention is not limited to the embodiments described but encompasses any variant within the scope of the invention as defined by the claims. In particular, the components may have another structure of that described. In an advantageous variant of the invention, and with reference to FIG. 2, each switch 10 is a MEMS-type electronic switch comprising a housing, generally designated 11, having a closed-edge side wall 12 extending between two plates. 13 to delimit a vacuum enclosure. The side wall 12 is divided into three connecting portions 12.1, 12.2, 12.3 which are electrically conductive and insulated from each other by electrically insulating portions 12.4, 12.5, 12.6. The connection portion 12.1 is connected to the motor, the connection portion 12.2 is connected to a positive potential source and the connection portion 12.3 is connected to a negative potential source. An electrically conductive contact element 14 (with, for example, a nickel / gold outer coating) extends from the first connection portion 12.1 to have its free end 14.1 movable between a first position in which the free end 14.1 is in position. contact with the second connection portion 12.2 to establish an electrical connection between these two connection portions and a second position in which the free end 14.1 is detached from the second connection portion 12.2. The free end 14.1 is movable between the second position and a third position in which the free end 14.1 is in contact with the third connection portion 12.3 to establish an electrical connection between these two connection portions. The second position therefore extends between the first position and the third position. The contact element 14 is arranged to be movable between its two positions under the effect of a field established between the two plates 13, that is to say a field normal to the plane of Figure 2. Each plate 13 is provided with an electrode 15 connected to a source of potential via the control circuit such that an electric field can be established between the plates 13. Such switches have a very short switching time in front of the reaction time of the engine. Thus, the return pulse sent by the motor to the first connection portion 12.1 during switching does not have time to pass in the connection portion 12.2, 12.3 being disconnected but will be directed in the connection portion 12.3, 12.2 being connected. It is therefore not necessary to provide freewheeling diodes to block this return pulse. The vacuum chamber prevents the formation of an arc during switching.
    [0011] Advantageously, the switches 10 of Figure 2 may be arranged in the form of a set of switches arranged in a matrix and connected to a control matrix circuit in which control signals generating fields in the switches circulate. Said assembly then preferably comprises a layer of polysilicon covered with an insulator on which the switches are arranged and means for charging the polysilicon layer to form a capacitor. The ability allows you to hold the field during an order. The pads may comprise at least one of the following materials: silver, indium, copper, nickel, titanium, aluminum. The pads as the envelope of iron, are involuntary interruption of the signal made in materials that are not sensitive to creep and oxidation so that the heat transfer performance is maintained during the estimated lifetime of the device.
    [0012] The thermally conductive and electrically insulating liquid comprises at least one of the following components: a silicone oil, a fluoropolyether such as that marketed by Solvay under the trade names Galden and Fomblin.
    [0013] In a simplified version, the module envelope can also directly exchange with an external heat transfer fluid without the intermediary of a thermal interface.
    权利要求:
    Claims (15)
    [0001]
    REVENDICATIONS1. An electronic device comprising at least one electronic component mounted on a support and surrounded by a deformable envelope containing a thermally conductive and electrically insulating liquid, the device comprising a thermal dissipation plate which is substantially parallel to the support and spaced from it, and conductive heat exchange means between the casing and the plate, the thermally conductive and electrically insulating liquid being chosen and the casing being arranged so that a thermal expansion of the liquid causes a force application of the casing against heat exchange means by conduction.
    [0002]
    2. Device according to claim 1, wherein the heat exchange means comprise thermally conductive pads which extend over the heat dissipation plate and which have free ends spaced from each other to make contact with the casing.
    [0003]
    3. Device according to claim 2, wherein the pads are arranged to be crushed by the envelope due to a thermal expansion of the thermally conductive liquid and electrically insulating.
    [0004]
    4. Device according to claim 3, wherein the pads may comprise at least one of the following materials: silver, indium, copper, nickel, iron, titanium, aluminum.
    [0005]
    5. Device according to claim 2, wherein the pads flare in the direction of the heat dissipation plate and / or the pads are of shape memory material so as to press the pad resiliently between the envelope and the plate in a predetermined operating temperature range.
    [0006]
    6. Device according to claim 1, wherein the support comprises a busbar-type electrical conductor, the device comprising means for compensating for differential expansions between the conductor and the component.
    [0007]
    7. Device according to the preceding claim, wherein the compensation means comprises a section of the conductor which extends in the vicinity of the component and is thinned in thickness.
    [0008]
    8. Device according to claim 1, wherein the thermally conductive and electrically insulating liquid comprises at least one of the following components: a silicone oil, a fluoropolyether.
    [0009]
    9. Device according to claim 1, comprising two power electronic components intended to be alternately conductive, the two components being superimposed on the same side of the support.
    [0010]
    10. Device according to claim 1, comprising at least two electronic components each arranged on one side of the support.
    [0011]
    11. Device according to claim 1, wherein the envelope is nickel alloy such as that produced under the brand "inconel".
    [0012]
    12. Device according to claim 11, wherein the envelope has a thickness between 10 pm and 100 pm.
    [0013]
    13. Device according to claim 1, wherein the envelope is arranged so that, below a predetermined temperature, the envelope is detached from the heat exchange means by conduction.
    [0014]
    The device of claim 1, wherein the component is a MEMS-type electronic switch comprising a housing having a closed contour sidewall extending between two plates for delimiting a vacuum enclosure, the sidewall comprising a first connection portion. and at least a second connecting portion which are electrically conductive and insulated from one another, a contact element extending from the first connection portion to have its free end movable between a first position in which the end free is in contact with the second connecting portion and a second position in which the free end is detached from the second connecting portion, the contact element being arranged to be movable between its two positions under the effect of a field established between the two plates.
    [0015]
    15. Device according to claim 14, wherein the side wall of the switch comprises a third connection portion and the contact element is arranged to have its free end movable between the first connection position and a third position in which the end free is in contact with the third connection portion, the second position being between the first and third position and the free end disconnected position being detached from the second connecting portion and the third connection portion.
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    同族专利:
    公开号 | 公开日
    FR3016266B1|2018-03-16|
    CN106068684B|2017-08-29|
    WO2015104285A1|2015-07-16|
    EP3092879B1|2021-03-03|
    US20160329266A1|2016-11-10|
    US9711432B2|2017-07-18|
    EP3092879A1|2016-11-16|
    CN106068684A|2016-11-02|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
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    法律状态:
    2015-12-22| PLFP| Fee payment|Year of fee payment: 3 |
    2016-12-21| PLFP| Fee payment|Year of fee payment: 4 |
    2017-02-17| CD| Change of name or company name|Owner name: SAFRAN ELECTRONICS & DEFENSE, FR Effective date: 20170111 |
    2017-12-21| PLFP| Fee payment|Year of fee payment: 5 |
    2019-12-19| PLFP| Fee payment|Year of fee payment: 7 |
    2020-12-17| PLFP| Fee payment|Year of fee payment: 8 |
    2021-12-15| PLFP| Fee payment|Year of fee payment: 9 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1450097|2014-01-07|
    FR1450097A|FR3016266B1|2014-01-07|2014-01-07|ELECTRONIC POWER DEVICE WITH IMPROVED COOLING|FR1450097A| FR3016266B1|2014-01-07|2014-01-07|ELECTRONIC POWER DEVICE WITH IMPROVED COOLING|
    EP15705209.3A| EP3092879B1|2014-01-07|2015-01-07|Electronic power device with improved cooling|
    CN201580003902.3A| CN106068684B|2014-01-07|2015-01-07|Electrical power device with improvement cooling|
    US15/110,026| US9711432B2|2014-01-07|2015-01-07|Electronic power device with improved cooling|
    PCT/EP2015/050157| WO2015104285A1|2014-01-07|2015-01-07|Electronic power device with improved cooling|
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